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Automated inspection for:
Parts and polarity
Component presence and position
Solder appearance fillet
Lead defects
Foreign material
Specifications of MF-760VT
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Applicable PCB |
Applicable manufacturing process |
Post reflow |
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PCB size |
20*40mm¡«320*450mm |
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PCB thickness |
+/-3mm ( for bending) |
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PCB clear height |
up:¡Ü30mm;down:¡Ü60mm |
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Inspection Items |
Post reflow |
Component missing, excessive component, solder ball, solder misalignment, edge-on, tombstone, mounting side down, wrong polarity, wrong component, bad component, solder bridging, cold soldering, solder unavailability, insufficient solder, excessive solder, component up, IC pin up, IC pin bent
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Vision System |
Image pickup system |
Color CCD |
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Illuminating system |
Four-color LED ring light source |
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Resolution |
15¦Ìm, 20¦Ìm |
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Inspection principle |
Color calculation, color extraction, grey-scale calculation, image contrast |
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Mechanic System |
X/Y driving system |
AC servo motor + precise ball lead-screw |
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Splint method |
Bilateral Automated Fixture |
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Positioning accuracy |
8¦Ìm |
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Moving speed |
700mm/s(Max) |
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Track adjustment |
Manual |
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Software System |
Operating system |
Windows XP |
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Language |
English& Chinese optional |
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Output |
Substrate ID, substrate names, element name, name of defects, defect pictures, etc |
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Optional accessories |
Offline programming system, SPC system, Barcode identification system, etc |
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Power supply |
AC 220V ±10£¥, 50/60Hz, 1KW |
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Temperature range |
-10-40¡æ |
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Ambient temperature |
-10-85£¥RH(frost free£© |
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Dimensions |
900×1000×1235mm |
PDF file download:20106231427152.jpg
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